- Main Chamber Size: 17" x 22"
- Sputtering Sources: 7 magnetron sources with in-situ tilt
- Two AJA 750W DC
- Shimadzu 1080 l/s magnetically levitated compound turbopump
- Two AJA RF (100W and 300W)
- One Pinnacle Plus 5k pulsed DC
- 8x 15cc crucibles
- Thin film evaporation of metals with electron beam
- 10 keV electron beam energy, 10 kW power
- Cryo pumped load lock and main chamber
- Substrates up to 100 mm
- Substrate rotation and tilt
- Full computer control
- 5 guns 2”
- 2DC and 2RF power supply
- substrate bias and heating
- 2 process gases
- Load lock and a fully automated process with computer Software Phase II